Investigación y prototipado de dispositivos de película fina con contactos selectivos para acoplar calor y corriente eléctrica

CódigoEEN TRAT20240205020
Alta en la Red: 6/2/2024
Deadline: 4/2/2025
Tipo: Demanda

Descripción An Austrian heat pump manufacturer wants to build the next generation of heat pumps based on semiconductor devices. Such devices could transport heat to work as cost-effective, scalable, and silent heat pump for any purpose. Based on commercial agreements, the company is seeking partners in semiconductors research and manufacturing to (1) evaluate the feasibility of the idea to use semiconductors as heat pumps, (2) form a consortium to research and build prototypes.

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